Topic 1: Electronic Technology

• 3D process and integration technology

• Substrate embedding and advanced flip chip packaging

• MEMS and sensor technology

• Wafer-level CSP and heterogeneous integration

• Design and Analysis of Transmission System

• New materials, equipment and 3D interconnection

• Wearable, flexible and stretchable electronics

• Optical interconnection and 3D photonics

• Digital system and logic design

• Computer architecture and VLSI

• Network-driven multi-core chip

• Advanced robotic system

• Motor

• Analog and digital electronics

• Signals and Systems

  
  

Topic 2: Information and Communication

• Electronic equipment

• Satellite and Space Communications

• Network and Information Security

• Signal processing for wireless communication

• Cognitive Radio and Software Radio

• Optical networks and systems

• Electromagnetic field theory

• Antenna, propagation and transmission technology

• Optical communication

• Radar signal and data processing

专题1：电子技术

• 3D流程和集成技术

• 基板嵌入和先进的倒装芯片封装

• MEMS和传感器技术

• 晶圆级CSP和异构集成

• 输电系统的设计与分析

• 新型材料，设备和3D互连

• 可穿戴，灵活和可伸展的电子产品

• 光学互连和3D光子学

• 数字系统与逻辑设计

• 计算机体系结构和VLSI

• 网络驱动的多核芯片

• 先进的机器人系统

• 电机

• 模拟和数字电子

• 信号与系统

  
  

专题2：信息和通信

• 电子设备

• 卫星与太空通讯

• 网络与信息安全

• 无线通信的信号处理

• 认知无线电和软件无线电

• 光网络和系统

• 电磁场理论

• 天线，传播和传输技术

• 光通讯

• 雷达信号与数据处理